EuQlid reveals a breakthrough diamond-based quantum sensing device for the non-invasive 3D imaging of semiconductors.
Abstract: This paper presents an accurate and fast 3D global localization method, 3D-BBS, that extends the existing branchand-bound (BnB)-based 2D scan matching (BBS) algorithm. To reduce memory ...
Abstract: A defective through-silicon via (TSV) may cause a small delay fault that is difficult to detect using conventional logic testing methods. Testing TSVs used for chip-to-chip interconnection ...
Scientists at EPFL have reimagined 3D printing by turning simple hydrogels into tough metals and ceramics. Their process allows multiple infusions of metal salts that form dense, high-strength ...