A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...
Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...
Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...
eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are ...
eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are ...
Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...
Workflow-driven EDA software and concurrent engineering for the next generation of dedicated AI chips, boosting AI ...
In today’s IC designs, effective power management through layout optimization is crucial for achieving PPA targets. This paper, written by Jeff Wilson, describes how the Calibre DesignEnhancer ...
A new technical paper titled “Interstellar: Fully Partitioned and Efficient Security Monitoring Hardware Near a Processor Core for Protecting Systems against Attacks on Privileged Software” was ...