In 2022, the CHIPS Act launched a $53 billion initiative to strengthen U.S. semiconductor manufacturing, spotlighting advanced packaging. Arizona emerged as a key player, with Amkor’s $2 billion ...

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

Transforming U.S. Semiconductor Manufacturing with a $1.4B Boost The U.S. Department of Commerce (DOC) has announced a $1.4 ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

The funds will enable new technologies to be validated and transitioned at scale.

GlobalFoundries plans to create a new center for advanced packaging and testing of essential chips in NY, with investments totaling $761M over the ...

The electronic board level underfill material industry is driven by the relentless pursuit of miniaturization in electronic ...

Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Months after leveraging federal funds to help build a semiconductor parts factory east of Atlanta, the Biden-Harris ...

Researchers from the City University of Hong Kong (CityUHK) have achieved a significant breakthrough in electronic packaging ...

The new $1 billion mill is expected to consume 20,000 tons of OCC per month and produce 1,500 tons per day of CRB.