Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
Datacenter Dynamics3d
Department of Commerce signs four new CHIPS funding agreements
The US Department of Commerce has signed four separate non-binding preliminary memoranda of terms to award more than $246 ...
Manufacturing3d
Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
KeyBanc upgrades chip stocks Applied Materials and Lam Research
Investing.com -- KeyBanc Capital Markets upgraded Applied Materials (NASDAQ: AMAT) and Lam Research (NASDAQ: LRCX) to ...
Electronic Design4d
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.
AZ Central5d
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
These and other investments under the CHIPS and Science Act ... in addition to $100 million for Applied Materials in Santa Clara, California, for packaging used in energy-efficient AI and ...
Digi Times3d
NEWS TAGGED ADVANCED PACKAGING
Topco Scientific, a supplier of semiconductor materials, anticipates substantial ... and insufficient capacity for advanced chip packaging in the semiconductor industry... In recent years ...