Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

What you are doing is building up a charge from the friction of your feet on a rug, transferring negative electrons and then ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality ...

Silicon designers quickly discovered that many of the complex yet often tedious tasks involved in their process – ...

Cambridge GaN Devices (CGD) will demonstrate at PCIM how GaN technology is delivering improved performance in higher power ...

In terms of connections, you can insert a full-sized plug into the front, plus two additional USB A ports and a USB C around ...

China’s SMIC has reportedly produced 5nm chips without EUV using DUV and SAQP, signaling a bold shift in chipmaking amid ...

Leverkusen, April 23, 2025: Elmos will be presenting smart IC solutions for cutting-edge applications in automotive and industrial electronics at Sensor+Test in Nuremberg (Hall 1, Booth 207) from May ...

If you're not sure what the media output switcher in Android is, you're not alone, but if you listen to music on your phone, ...

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

TSMC is currently one of the most renowned companies in the tech industry. Its factories produce chips for major names in segments such as mobile processors and AI hardware. The firm’s next ...

Taiwanese chip giant Taiwan Semiconductor Manufacturing Company (TSM), better known as TSMC, is racing to stay ahead in the AI chip race. The company has announced plans to roll out its 1.4nm A14 ...