Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality ...

The FAMES Pilot Line focuses on five sets of technologies that are well-adapted to low power that will enable new chip ...

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; ...

CDNS expands its collaboration with TSMC to accelerate time to silicon for advanced-node and 3D-IC technologies.

Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio ...

In the collaboration, AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications ...

China’s integrated circuit (IC) imports and exports continued to rise in both volume and value in the first quarter, as ...

China has waived its retaliatory 125 per cent tariffs on certain semiconductor imports from the US, according to a Caijing report.