Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched as the company navigates intensifying market competition.

SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT ...

Samsung Electronics has nominated two top chip executives, Jun Young-hyun and Song Jai-hyuk, to its board as the company aims ...

SK hynix has tapped Vice President Lee Woong-sun to spearhead its advanced chip packaging plant in the US. Lee has been ...

Samsung Vice Chairman Jeon Young-hyun meets with NVIDIA CEO Jensen Huang to discuss supplying NVIDIA with is new HBM3E memory ...

Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its ...

South Korea's SK Hynix forecast sales of its high-end semiconductors used in generative artificial intelligence chipsets would more than double this year, after reporting a quarterly profit record ...

Samsung (SSNLF) plans to cancel 3.05T won (about $2.11B) worth of its stock that it had acquired previously, according to a ...

Looking ahead, however, the ratio of HBM to SK Hynix's sales will not increase significantly from here as we believe shipments of general DRAM will recover as investment in general-purpose servers ...

According to industry sources on the 12th, CXMT is reportedly investing in facilities to produce HBM2, a second-generation HBM product. HBM2 is a product that Samsung Electronics and SK hynix ...