Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched as the company navigates intensifying market competition.
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT ...
Samsung Electronics has nominated two top chip executives, Jun Young-hyun and Song Jai-hyuk, to its board as the company aims ...
SK hynix has tapped Vice President Lee Woong-sun to spearhead its advanced chip packaging plant in the US. Lee has been ...
Samsung Vice Chairman Jeon Young-hyun meets with NVIDIA CEO Jensen Huang to discuss supplying NVIDIA with is new HBM3E memory ...
Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its ...
Samsung (SSNLF) plans to cancel 3.05T won (about $2.11B) worth of its stock that it had acquired previously, according to a ...
Increased competition from Chinese makers may force leading DRAM makers to phase out DDR3 and DDR5 SDRAM by end of the year.
According to industry sources on the 12th, CXMT is reportedly investing in facilities to produce HBM2, a second-generation HBM product. HBM2 is a product that Samsung Electronics and SK hynix ...
Micron Technology set to begin mass production of its 12-stack HBM and will supply it to NVIDIA, according to reports.
Micron Technology (NASDAQ: MU) stock is posting big gains in Tuesday's trading. The memory chip and storage solutions company ...
Micron Technology faces DeepSeek-led AI compute questions that could throttle its HBM growth opportunity. Click here to read ...