Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, ...

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...

Gallium nitride, a semiconductor renowned for its efficiency and high-speed capabilities, has long been recognized as a ...

The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art data centers.