The company is expanding its IP portfolio for AI training applications with TSMC9000-certified 3D-IC IP, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E 10.4G in N3P, as well as UCIe 16G N3P ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...

Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs. "Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and ...

To support the increasing demand for scalable electromagnetic analysis, Ansys is introducing a new HFSS-IC product family. HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC ...

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...