In the collaboration, AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications ...

Through continued collaboration with TSMC, Ansys  today announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

3D-IC technology complements conventional transistor scaling to enable designers to achieve higher levels of integration by allowing multiple die to be stacked vertically, or in a side-by-side "2 ...

The impact of 3D integration versus 2D on the thermal profile in the package was compared. Figure 1 shows the complete package with cooling and PCB (left), chip layers for 2D and 2-dies 3D-IC with ...

AI-Driven Digital and Analog Flows, Multi-Die Innovations, and Broad IP Portfolio Deliver Unmatched Performance, Power and ...

Kageshima, Performance analysis of 3D-IC for multi-core processors in sub- 65nm CMOS technologies, Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on, 2010, pp.

Agilysys, Inc. , a leading global provider of hospitality software and services, today announced that Bally's Baton Rouge Hotel (formerly the Belle of Baton Rouge Hotel) in downtown Baton Rouge, ...

The FAMES Pilot Line focuses on five sets of technologies that are well-adapted to low power that will enable new chip ...

Japan's Hatsushima Station was built in just six hours using cutting-edge 3D printing. This innovation by Serendix addresses workforce issues and cuts costs significantly.

JCET is dedicated to pioneering advanced packaging technologies and fostering collaborative development across the industry chain. In 2024, R&D expenditures reached RMB 1.72 billion, an increase of 19 ...