Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Kageshima, Performance analysis of 3D-IC for multi-core processors in sub- 65nm CMOS technologies, Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on, 2010, pp.

Through continued collaboration with TSMC, Ansys (NASDAQ: ANSS) today announced enhanced AI-assisted workflows for radio ...

The impact of 3D integration versus 2D on the thermal profile in the package was compared. Figure 1 shows the complete package with cooling and PCB (left), chip layers for 2D and 2-dies 3D-IC with ...

3D integration enables heterogeneous integration of IC chips fabricated with different technologies and materials, and thus permits the realization of integrated, sophisticated, and multifunctional ...

3D-IC technology complements conventional transistor scaling to enable designers to achieve higher levels of integration by allowing multiple die to be stacked vertically, or in a side-by-side "2 ...

Japan based OKI is applying its Crystal Film Bonding (CFB) technology to fabricate chiplet based 3D IC heterogenous integrated devices particularly for analog semiconductor ICs. OKI's proprietary CFB ...

In the collaboration, AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications ...