The brief was that the wafer probe yield was disastrous and the correlation wafer was not giving the correct results. Getting to the punch line is going to require some IC fabrication background ...

Teradyne has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce ...

Smiths Interconnect has introduced a production probe head for wafer-level packages and known good die. Part of its Volta range Volta 180 is a WLCSP test connector for chips with 180um pitch IO. The ...

NORTH READING, Mass., March 31, 2025--(BUSINESS WIRE)--Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics ...

The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market. By enabling high-throughput electro-optical testing of ...