The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
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AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new techAlthough AMD no longer produces its own chips, instead subcontracting them ... Glass substrates are made from materials like borosilicate, quartz, and fused silica, which provide notable benefits ...
Applied Materials has been an 800-pound gorilla ... vertical and 3-D designs), high-bandwidth memory and advanced chip packaging. Supporting these technologies requires better materials and ...
Flip-chip and other packages consist of several components, such as a base material or substrate. In total, the U.S. fabricates only 1.3% of all substrates for packaging, while the rest comes from ...
The funds will enable new technologies to be validated and transitioned at scale.
Months after leveraging federal funds to help build a semiconductor parts factory east of Atlanta, the Biden-Harris ...
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
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