Federal funding boosts US chip packaging with $1.4B in CHIPS Act awards
The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...
Manufacturing3d
Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
Chattanooga Times Free Press4d
Feds chip in extra $100 million to help Georgia semiconductor materials plant
Months after leveraging federal funds to help build a semiconductor parts factory east of Atlanta, the Biden-Harris ...
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.
Electronic Design4d
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
Morningstar4d
Smartkem Completes First Sale of its TRUFLEX® Semiconductor Materials to Chip Foundation under their Co-Development Agreement
Additional sales of RDL materials to Chip Foundation ... the cost advantage is very significant. Chip Foundation have developed wafer-level packaging technology based on thin-film chips and ...