This is a sponsored article brought to you by Siemens. In the world of electronics, integrated circuits (IC) chips are the ...

Oki Electric Industry and Nisshinbo Micro Devices in Tokyo are collaborating to develop a new type of thin-film 3D analogue IC. These chips are designed to ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Recently, the scientists have successfully generated a three-dimensional microstructural “panoramic image” with sub-5-nanometer resolution.

China is demanding sensitive sales data from US semiconductor firms, including Texas Instruments and Analog Devices, as part ...