Oki Electric Industry and Nisshinbo Micro Devices in Tokyo are collaborating to develop a new type of thin-film 3D analogue IC. These chips are designed to ...

Recently, the scientists have successfully generated a three-dimensional microstructural “panoramic image” with ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Today we are going to create a strobe light for the tips of the wings of an rc airplane using a 555 timer (NE 555 or lm 555 ...

The People's Republic of China has deepened its anti-dumping probe into U.S. companies producing analog integrated circuits ...

China is demanding sensitive sales data from US semiconductor firms, including Texas Instruments and Analog Devices, as part ...