Previous studies have shown that In10Ag TIMs outperform polymer-based TIMs in both end-of-line (EOL) testing and long-term ...

Researchers develop an industry-scalable method to tune thermal conductivity in thin films using femtosecond lasers.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...