This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...

Micron Technology (MU) aims to bolster its position in the high-bandwidth memory (HBM) market. The company plans to ramp up production of its ...

Chinese AI startup DeepSeek has demonstrated a cost-effective approach to high-performance AI, potentially disrupting SK ...

New Delhi, Jan. 31, 2025 (GLOBE NEWSWIRE) -- The global high bandwidth memory market was valued at US$ 501.0 million in 2024 and is expected to reach US$ 5,810.5 million by 2033, at a CAGR of 31.3 ...

“AI clusters today are one of the major uses of High Bandwidth Memory (HBM). However, HBM is suboptimal for AI workloads for several reasons. Analysis shows HBM is overprovisioned on write performance ...

thanks in large part to its high bandwidth memory (HBM). As AI drove demand for hardware from AMD, Nvidia and others, firms like Micron, Samsung and SK Hynix rushed to supply the necessary HBM chips.

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth ...