The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art data centers.

Innotek recently announced a significant advancement in semiconductor substrate technology called copper post, or Cu-Post, ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...

Synopsys Inc. (NASDAQ:SNPS) is one of the best software infrastructure stocks to invest in. On June 26, Frost & Sullivan ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

GamersNexus investigates fake AMD Ryzen 7 9800X3D processor, discovering a non-functional chip with no CCDs or I/O chiplet ...

Gallium nitride, a semiconductor renowned for its efficiency and high-speed capabilities, has long been recognized as a ...

A new 3D chip stacking method developed in Japan promises to revolutionize AI and high-performance computing with faster data transfer, reduced power consumption, and compact integration.

With major manufacturers racing to make smartphones ever thinner, ways to minimize the size of smartphone components have become increasin ...