[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

The integration level of a system-on-chip (SoC) is defined in RTL, just like the rest of the design. Historically, RTL has been built through text editors. However, a decade or more ago, the sheer ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

Some joint-design considerations are universal; others vary with the assembly methods used. Each joining technique has particular design requirements, while certain joint requirements may suggest a ...

See how Bosch Rexroth’s MTpro simplifies assembly system design through a digital-first, self-service approach. Engineers can design systems and layouts, select components, export CAD models, and ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.