There is a bit of a paradox when it comes to miniaturization. When electronics replaced mechanical devices, it was often the case that the electronic version was smaller. When transistors and ...

However, new multi-sensor platforms, wearable systems, and the rush to connect things to the Internet are reigniting sales once again, says IC Insights. Total MEMS-based semiconductor sales—sensors ...

Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...

The company is expanding its IP portfolio for AI training applications with TSMC9000-certified 3D-IC IP, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E 10.4G in N3P, as well as UCIe 16G N3P ...

This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs. "Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...