There is a bit of a paradox when it comes to miniaturization. When electronics replaced mechanical devices, it was often the case that the electronic version was smaller. When transistors and ...

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

However, new multi-sensor platforms, wearable systems, and the rush to connect things to the Internet are reigniting sales once again, says IC Insights. Total MEMS-based semiconductor sales—sensors ...

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design ...

This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs. "Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and ...

The launch of STAr Virgo Prima, which is one of probe card series for semiconductor parametric and reliability test, presents the achievement in 3D/2.5D MEMS probe card development for WAT test ...

Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...

The company is expanding its IP portfolio for AI training applications with TSMC9000-certified 3D-IC IP, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E 10.4G in N3P, as well as UCIe 16G N3P ...