Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

“Heterogeneous technology architectures are ripe for 3D integration,” says Maurice Steinman, vice president of engineering for Lightelligence. “Consider mixed technology assemblies, such as a photonic ...

UMass Amherst researchers have developed a laser-based holographic alignment method that could revolutionize overlay accuracy ...

3D integration enables heterogeneous integration of IC chips fabricated with different technologies and materials, and thus permits the realization of integrated, sophisticated, and multifunctional ...

Japan based OKI is applying its Crystal Film Bonding (CFB) technology to fabricate chiplet based 3D IC heterogenous integrated devices particularly for analog semiconductor ICs. OKI's proprietary CFB ...

3D-IC technology complements conventional transistor scaling to enable designers to achieve higher levels of integration by allowing multiple die to be stacked vertically, or in a side-by-side "2 ...

ACM Research's Ultra ECP ap-p tool has won the 2025 3D InCites Award in the Technology Enablement category. This award honors ...