Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...
AI can help with workload distributions when considering on-device versus cloud processing. The latter has a very large ...
Cadence (Nasdaq: CDNS) today announced the expansion of its multi-year collaboration with NVIDIA, focusing on driving ...
As demand for smaller, more power efficient and higher performing ICs continues to challenge the global IC design community, next-generation devices increasingly feature complex 2.5D and 3D ...
The purpose is to demonstrate the feasibility of 3D IC architecture for SoC design. The partitioning scheme is done manually at block level where USB controller, H.264 encoder block with its local ...
IEEE Spectrum on MSN13d
Japanese Companies Develop Thin-film 3D Analog ICsD espite the relentless advance of digital technology into every area of business, industry, and leisure activities, analog ...
empowering 3D-IC designers to visualize physics simulations in real time. This enhancement aims to improve semiconductor design for key industries, including 5G/6G, IoT, AI, cloud computing ...
According to Siemens, and in collaboration with TSMC, it has delivered a certified Xpedition Package Designer automated workflow driven by the Innovator3D IC that can provide customers with an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback